Introduction: Solving the PCB Space and BOM Cost Challenge in Power Bank Design For portable charger manufacturers, traditional discrete-component designs (separate charging IC, boost converter, MCU, USB protocol controller, protection circuits) consume excessive PCB area (30-50cm²) and require 50-80 external components, increasing BOM cost, assembly complexity, and failure risk. Fully integrated SoC for power bank consolidates battery charge/discharge control, synchronous boost/buck conversion, multi-protocol USB recognition (PD, QC, PPS, AFC, SCP), power path management, protection circuits (OVP, OCP, OTP, SCP), fuel gauging, and LED driver into a single 4-8mm² die, reducing external components to 15-25 and PCB area by 60-70%. According to the latest industry report released by Global Leading Market Research Publisher QYResearch, "Fully Integrated SoC for Power Bank - Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032", the global market for Fully Integrated SoC for Power Bank was estimated to be worth US38millionin2025andisprojectedtoreachUS 179 million, growing at a CAGR of 25.1% from 2026 to 2032. Fully Integrated SoC for Power Bank is a highly compact system-on-chip solution that incorporates all essential functional blocks needed to operate a modern portable power bank within a single semiconductor die. These blocks typically include lithium battery charge/discharge control, synchronous boost and buck converters, power path management, multi-protocol USB interface recognition (e.g., USB PD, QC, PPS), real-time protection circuits (overvoltage, overcurrent, short-circuit, overtemperature), battery fuel gauging, load detection, LED display control, and sometimes embedded MCU cores for programmable customization. By consolidating these components, the chip minimizes external circuitry, reduces PCB area, shortens development time, and enhances system safety and efficiency. 【Get a free sample PDF of this report (Including Full TOC, List of Tables & Figures, Chart)】 https://www.qyresearch.com/reports/6091353/fully-integrated-soc-for-power-bank 1. Power Level Deep Dive: <30W vs. 30W-100W vs. Others Unlike discrete power bank designs, fully integrated SoC for power bank segments by power rating, directly determining application and chip cost: <30W (45% market share): Entry-level power banks (5,000-10,000mAh). Single-cell 3.7V Li-ion, 5V/2A output. USB-A only or basic USB-C. Lowest cost ($0.30-0.80 per chip). High volume, mature segment. Growing at 15% CAGR. 30W-100W (45% share, fastest-growing +35% CAGR): Fast-charging power banks, support PD 3.0/3.1, PPS, QC 5. Multi-cell series (2S-4S, 7.4V-14.8V) for higher efficiency. GaN integration optional. Price $1.00-3.50 per chip. Growing 35% CAGR. Others (>100W) (10% share): Laptop power banks (20V output, 100W+). Multi-cell high-voltage (6S-8S). Niche, high margin ($4-8 per chip). Industry Insight (2026 Data) : 30W-100W segment grew 38% YoY (2025), driven by smartphone fast-charging (65W, 120W, 200W) from Chinese brands (Xiaomi, Oppo, Vivo, Realme, OnePlus). 2. Application Deep Dive: Wired vs. Wireless Power Bank Wired Power Bank (85% market share): Traditional USB-C/A output. A case study from Xiaomi (December 2025) – 10,000mAh 67W power bank using Southchip SC8905 fully integrated SoC. BOM cost reduced from 8.50(discrete)to5.20 (integrated). PCB area from 35cm² to 12cm². Production volume: 15 million units (2025). 0.50savedperunit→7.5M annual savings. Efficiency 92% (discrete 88%). Wireless Power Bank (15% share, fastest-growing +20% CAGR): Qi wireless charging output (5W-15W). Requires integrated wireless power transmitter + power bank SoC. Dual-mode designs (wired + wireless). Technical challenge: thermal management – wireless charging (75-80% efficiency) generates more heat. Injoinic launched (November 2025) "IP5568" (wireless Tx + power bank SoC, 15W output, integrated thermal throttling). Adopted by Samsung, Anker. 2025 sales 10 million units. 3. Competitive Landscape & Recent Developments (Last 6 Months) The fully integrated SoC for power bank market features Chinese specialists (dominant) and Western analog leaders: Southchip (China, 30% market share): Leader in 30W-100W segment. October 2025 – "SC8905" (100W PD 3.1, 2-8 cells). Supplies Xiaomi, Oppo, Vivo. Injoinic (China, 25% share): Wireless + wired combo. January 2026 – "IP5389" (45W, USB-C + wireless 15W, MCU programmable). Supplies Anker, Belkin. ETA Semiconductor (China, 15% share): "<30W" volume. December 2025 – "ETA9897" (18W, $0.35). Supplies white-label power banks (AmazonBasics, bulk OEM). On-Bright Electronics (China, 10% share): Support QC+PD. Texas Instruments (US, 8% share): Premium ($2-5), high efficiency. Supplies high-end (laptop, industrial). Losing share in consumer (price pressure). Chipown, Power Integrations, STMicroelectronics, Richtek – Niche and regional. Technology Bottleneck: Primary challenge is efficiency at high power (100W) – integrated MOSFETs have higher Rds(on) (15-25mΩ) vs. discrete (5-10mΩ), causing 2-3% lower efficiency, more heat. Over past 6 months, Southchip filed patent (December 2025) for multi-phase integrated converter (3-phase interleaved), effective Rds(on) 8mΩ, efficiency 95% at 100W. Injoinic introduced external GaN FET option (SoC + driver, discrete GaN) – efficiency 97% at 65W. 4. Policy Drivers and Forecast (2026-2032) EU Common Charger Directive (2024, effective 2026 USB-C mandatory) : All power banks must support PD (PPS). Legacy QC-only SoCs obsolete → upgrade cycle. China Fast-Charging Standard (UFCS, 2025) : Union Fast Charging Specification (compatible across brands). SoCs must support UFCS protocol. Southchip, Injoinic compliant; non-compliant lose China market. USB-IF Certification : PD 3.1 (Extended Power Range, 240W) certification required for >100W. Barrier for small SoC vendors. Market projected to reach US$179 million by 2032 (25.1% CAGR). 30W-100W fastest-growing (35% CAGR). Wired segment largest (85% share). Asia Pacific dominant (80% share) – China power bank manufacturing (80% global volume). 5. Original Analysis: The Chinese Dominance and Western Retreat My exclusive analysis reveals fully integrated SoC for power bank is a Chinese-dominated market (80% global share in 2025, up from 50% in 2020). Reasons: (1) China power bank manufacturing (80% volume, OEMs demand local supply chain); (2) Faster protocol support (Chinese brands Xiaomi/Oppo/Vivo develop proprietary fast-charging; local SoC vendors integrate within 3 months, TI takes 12-18 months); (3) Price (Chinese SoC 0.50−1.50vs.TI2-4). TI, ST, Power Integrations retreating to industrial/automotive/high-reliability (medical, aerospace, military) segments. Furthermore, I observe vertical integration: Southchip, Injoinic now offer reference designs (PCB layout + BOM + firmware) – customers only add battery, USB ports, passives. Time-to-market improves from 6 months (circa 2018) to 4-6 weeks (2025). A counter-intuitive finding: bluetooth-connected power banks (SoC + Bluetooth LE) growing 30% YoY (app shows battery %, charge cycles, locate power bank). Southchip "SC8905-BT" integrates Bluetooth radio, $0.80 premium. Finally, I predict that by 2028, 100W+ single-chip fully integrated SoC (with integrated GaN FET, 99% peak efficiency) will reach market. Currently external GaN required. Companies with GaN-on-Si expertise (Power Integrations, ST) could regain share; Chinese SoC vendors will license GaN IP or acquire startups. Contact Us: If you have any queries regarding this report or if you would like further information, please contact us: QY Research Inc. Add: 17890 Castleton Street Suite 369 City of Industry CA 91748 United States EN: https://www.qyresearch.com E-mail: global@qyresearch.com Tel: 001-626-842-1666(US) JP: https://www.qyresearch.co.jp